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SK Hynix vows to build 600-layer NAND flash chips — now up to 176 layers
22.03.2021 [18:33],
Konstantin Khodakovsky

NAND flash memory chips will receive more than 600 layers as memory technology advances, SK Hynix Executive Director Lee Seok-hee said at the International Reliability Physics Symposium (IRPS) conference organized by the Institute of Electrical and Electronics Engineers ( IEEE).

Yonhap

Mr. Li said, “In both DRAM and NAND, the company is working to improve not only memory semiconductor materials, but also structural structures and reliability to increase technological efficiency. If current efforts are successful, we can scale DRAM chips below 10nm and stack NAND in over 600 layers. «.

It is worth noting that the most advanced NAND flash memory to date has «only» 176 layers — it was developed by the American company Micron. SK Hynix became the second developer of the 176-layer chip last year and plans to start mass production of such solutions this year, earlier than Samsung Electronics.

Samsung Electronics

Lee’s comments on the development of the 600-layer chip show the company’s desire to remain at the forefront of global NAND chip manufacturing and its confidence in the attainability of such metrics.

The manufacturer is currently improving the structures of its HARC etch technology to be able to stack more layers in NAND production. According to the head, the company also applied atomic layer deposition technology to preserve the dielectric characteristics of the cell. And to solve the problem of film stress, the company is trying to optimize the oxide and nitride materials of the cell.

Reliability is also a key factor for memory chips as they expand their scope. “Until now, high density, high speed and low power have been required to meet the needs of various applications and customers,” he said. “But now, beyond these requirements, there is a growing demand for high reliability performance in the growing markets of smart information and communication technologies like self-driving cars and smart healthcare, where memory is expected to work for a long period of time in extreme conditions.”.

SK hynix

To overcome the limitations of memory performance in the next 10 years, manufacturers will begin to combine DRAM memory in the same package or on the same chip with other system components such as the central processing unit. Among the advantages of SSD over HDD, he named the low power consumption of NAND, which can reduce carbon dioxide emissions by 93%. «If hard drives in data centers around the world are replaced by solid-state drives, the world can reduce its carbon footprint by 41 million tons by 2030,» said the executive. «SK Hynix will continue to implement solutions that help reduce energy consumption while offering better computing performance.».

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